ECIA has issued a follow up Industry Alert from its Global Industry Practices Committee (GIPC) experts to update members on last Friday’s U.S. Supreme Court tariff ruling. The U.S. Supreme Court has ...
Series ultra-broadband multilayer ceramic capacitors engineered for high-speed optical communication systems operating from 7kHz to 110GHz. Series now includes 15 part numbers with new 0402 ...
STOCKHOLM, SWEDEN – Note has secured a defense electronics order valued at SEK 135 million from a long-term Nordic customer for advanced printed circuit board assemblies.
MUMBAI – Fine-Line Circuits Limited reported a 19.5% year-over-year decline in third quarter revenue while posting a 14.8% increase in net profit.
MIAMI, FL – Element Solutions reported 2025 net sales of $2.5 billion, up 4% year over year on a reported basis and 6% organically, driven by double-digit organic growth in its electronics segment ...
AUSTIN, TX – Creative 3D Technologies (C3DT) has raised $5 million in seed funding to expand its modular “Factory-in-a-Box” manufacturing platform.
Keysight Technologies introduced 3D Interconnect Designer, a software platform developed to support the design of complex interconnect structures in chiplet and three-dimensional integrated circuit ...
MOSCOW, ID – Schweitzer Engineering Laboratories has begun site preparation for a new $50 million, 250,000-square-foot electronic device manufacturing facility at its Schwartz Campus, expanding ...
SAN JOSE, CA – Cadence reported 13% growth in its system design and analysis business in fiscal 2025, reflecting sustained demand for advanced packaging and system-level simulation tools used in AI ...
Molex introduced Impress Co-Packaged Copper Solutions, a compression-based connector and cable assembly designed for near-ASIC connectivity in high-speed data center systems. The solution supports ...
LONDON, UK – The global wearable technology market is expected to nearly double in value by the end of the decade, fueled by growing demand for health monitoring, artificial intelligence integration ...
AURORA, CO ― February 2026 ― AdvancedPCB has installed a MASS VCP-5000 Vacuum Via Filling System at its Santa Clara facility, increasing capacity for advanced HDI and high-reliability printed circuit ...